25.07.17

InterPACK 2017

August 29 - September 1 in San Francisco, California

InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).

Stäubli Connectors will showcase its proven technology and how it is used in confidence with electronic thermal management systems operating in a wide variety of demanding environments. At the Stäubli booth we will feature a complete line of all-metallic, non-spill, dry-break, quick-disconnect couplings for electronics cooling applications. We offer couplings that can be used with systems that have access to the point of connection, and "blind mate" couplings that enable the flow of cooling fluids simply by sliding system components together.

Click here to register for InterPACK.

For more information: https://www.asme.org/events/interpack